佛智芯微電子副總經理先進封裝大板扇出研發(fā)及功率器件封裝應用The Research on Panel Level Fan Out Package and its Application on Power Electronics林挺宇廣東佛智芯微電子技術研究有限公司副總經理，廣東省半導體智能裝備與系統(tǒng)集成創(chuàng)新中心首席科學家Tingyu LINDeputy General Manager of Guangdong FZX Microelectronics Technology Co. Ltd, Principal Scientist of CNC Equipment Cooperative Innovation Institute
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