CSP芯片級封裝在Mini-LED背光中的應用進展The Progress of Chip Scale Package in Mini-LED TV Backlighting劉國旭北京易美新創(chuàng)科技有限公司CTO、執(zhí)行副總裁Jay Guoxu LIUCTOExecutive VP of ShineOn Innovation Technology Co., Ltd
MINILED 驅動在TV顯示器背光上的應用廖賢賓華源智信半導體（深圳）有限公司電源事業(yè)部系統(tǒng)應用總監(jiān)LIAO Xianbin System Application Director of Power Supply Division of Huayuan Semiconductor（Shenzhen）Co.,Ltd
用于藍綠光Mini/Micro-LED生產(chǎn)的MOCVD新型裝備Blue/Green Mini and Micro-LEDs Grown on Large Size Substrates for Advanced Display Applications陳耀中微公司MOCVD工藝總監(jiān)Yao CHENDirector of MOCVD Process Technology，Advanced Micro-Fabrication Equipment Inc. China
背光模組中Mini LED對封裝材料的要求與挑戰(zhàn)Requirements and Challenges for Packaging Materials for Mini LEDs used in Backlight Modules徐建軍北京康美特科技股份有限公司首席技術官Jianjun XUCTO of Beijing KMT Technology Co., Ltd.
Mini/Micro LED 大尺寸顯示產(chǎn)品及技術發(fā)展趨勢Mini/Micro LED Large-size Display products and Technology Development Trend汪洋長春希達電子技術有限公司副總經(jīng)理WANG YANGDeputy General Manager of Changchun Cedar Electronics Technology Co., Ltd.
